Electronic Packaging and Production

RIOR FUCINAC PACKAGING MO PROOCTION CONTINCI Electronic Packaging
& NEPCON Production are pleased to announce MILTON S KIVER Excellence in
Electronics Packaging and Production AWARDS Edited by Jack Smith ...

Author:

Publisher:

ISBN:

Category: Electronic apparatus and appliances

Page:

View: 318


Manufacturing Challenges in Electronic Packaging

This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.

Author: Y.C. Lee

Publisher: Springer Science & Business Media

ISBN: 9780412620300

Category: Science

Page: 261

View: 205

About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.

National Electronic Packaging and Production Conference NEPCON WEST Held in Anaheim California on February 25th Through 27th 1986

Author:

Publisher:

ISBN:

Category:

Page:

View: 788


The Electronic Packaging Handbook

The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Author: Glenn R. Blackwell

Publisher: CRC Press

ISBN: 9781420049848

Category: Technology & Engineering

Page: 640

View: 570

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

National Electronic Packaging and Production Conference 1990 West

Author: National Electronic Packaging and Production Conference

Publisher:

ISBN: 9780783701462

Category:

Page: 929

View: 791


Proceedings of the Technical Programme

Author: International Electronic Packaging & Production Conference

Publisher:

ISBN:

Category: Semiconductors

Page: 312

View: 733


NEPCON East 90

Author:

Publisher:

ISBN:

Category:

Page:

View: 454


Proceedings of the Technical Program

Author:

Publisher:

ISBN:

Category: Electronic apparatus and appliances

Page: 616

View: 758


NEPCON East

Author:

Publisher:

ISBN:

Category:

Page:

View: 507


Nepcon West

Author:

Publisher:

ISBN:

Category:

Page:

View: 764


The Electronics Assembly Handbook

This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including ...

Author: Frank Riley

Publisher: Springer Science & Business Media

ISBN: 3662131617

Category: Technology & Engineering

Page: 603

View: 450

The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.

INTERNEPCON U K 80

Author: Kiver Communications Limited

Publisher:

ISBN:

Category:

Page:

View: 129


Proceedings of the Technical Program National Electronic Packaging and Production Conference

Author:

Publisher:

ISBN:

Category: Electronic apparatus and appliances

Page: 517

View: 269


NEPCON West 95

Author:

Publisher:

ISBN:

Category:

Page:

View: 457


NEPCON West 92

Author:

Publisher:

ISBN:

Category:

Page:

View: 451


Electronic Components Packaging and Production

Author: Leif Halbo

Publisher:

ISBN: 9788299219327

Category:

Page:

View: 419


Proceeding of the Technical Program

Author:

Publisher:

ISBN:

Category: Electronic apparatus and appliances

Page: 742

View: 872


Electronic Packaging and Interconnection Handbook

No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package.

Author: Charles A. Harper

Publisher: McGraw-Hill Professional Publishing

ISBN:

Category: Technology & Engineering

Page: 992

View: 787

Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook, Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package. Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more.

Modeling and Simulation for Microelectronic Packaging Assembly

In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter.

Author: Sheng Liu

Publisher: John Wiley & Sons

ISBN: 0470828412

Category: Technology & Engineering

Page: 288

View: 969

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

CONNECTOR

Author: Kiver Communications Limited

Publisher: ICON Group International

ISBN:

Category: Automobiles

Page: 6

View: 308