Thermal Stress and Strain in Microelectronics Packaging

How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.

Author: John Lau

Publisher: Springer Science & Business Media

ISBN: 1468477676

Category: Technology & Engineering

Page: 884

View: 519

Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.

Thermal Stress and Strain in Microelectronics Packaging

Author: John Lau

Publisher:

ISBN: 9781468477689

Category:

Page: 908

View: 793


Micro and Opto Electronic Materials and Structures Physics Mechanics Design Reliability Packaging

E. Suhir, Predicted bow of plastic packages of integrated circuit (IC) device, Thermal Stress and Strain in Microelectronics Packaging, Van Nostrand Reinhold, New York, 1993. 4. R. Jones, Mechanics of Composite Materials, ...

Author: Ephraim Suhir

Publisher: Springer Science & Business Media

ISBN: 0387329897

Category: Technology & Engineering

Page: 1460

View: 517

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Chip On Board

Lau , J. H. , Thermal Stress and Strain in Microelectronics Packaging , Van Nostrand Reinhold , New York , 1993 . 14. Lau , J. H. , Handbook of Tape Automated Bonding , Van Nostrand Reinhold , New York , 1992 . 15.

Author: John H. Lau

Publisher: Springer Science & Business Media

ISBN: 9780442014414

Category: Computers

Page: 556

View: 988

This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.

Lead Free Solder Interconnect Reliability

... Vibration- Induced Solder Joint Failure of a Ceramic Column Grid Array (CCGA) Package, 54th Electronic Components ... Thermal Stress Issues in Plated-Through-Hole Reliability, Thermal Stress and Strain in Microelectronics Packaging, ...

Author: Dongkai Shangguan

Publisher: ASM International

ISBN: 161503093X

Category: Technology & Engineering

Page: 292

View: 414


Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

E. Suhir, “Thermal Stress Failures in Microelectronic Components - Review and Extension,” in A. Bar-Cohen, A.D. Kraus, (eds.) ... Thermal Stress and Strain in Microelectronics Packaging, Van-Nostrand Reinhold, 1993. 18.

Author: Ephraim Suhir

Publisher: CRC Press

ISBN: 0429863829

Category: Technology & Engineering

Page: 344

View: 570

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Thermal Stress and Strain in Microelectronics Packaging. Van Nostrand Reinhold, New York. Lesk, I.A., Thomas, R. E., Hawkins, G., Remmel, T. P., and Rugg, J. (1990). Progression of damage caused by temperature cycling on a large die in ...

Author: Gerard Kelly

Publisher: Springer Science & Business Media

ISBN: 1461550114

Category: Technology & Engineering

Page: 134

View: 833

One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time. How can this be done? Firstly, package structures, materials, and manufacturing processes must be optimised. Secondly, it is necessary to predict the likely failures and behaviour of parts before manufacture, whilst minimising the amount of time and money invested in undertaking costly experimental trials. In a high volume production environment, any design improvement that increases yield and reliability can be of immense benefit to the manufacturer. Components and systems need to be packaged to protect the IC from its environment. Encapsulating devices in plastic is very cheap and has the advantage of allowing them to be produced in high volume on an assembly line. Currently 95% of all ICs are encapsulated in plastic. Plastic packages are robust, light weight, and suitable for automated assembly onto printed circuit boards. They have developed from low pincount (14-28 pins) dual-in-line (DIP) packages in the 1970s, to fine pitch PQFPs (plastic quad flat pack) and TQFPs (thin quad flat pack) in the 1980s-1990s, with leadcounts as high as 256. The demand for PQFPs in 1997 was estimated to be 15 billion and this figure is expected to grow to 20 billion by the year 2000.

Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture

Thermal stress and strain in microelectronics packaging. Van Nostrand Reinhold. Lee, M., & Jasiuk, I. (1991). Asymptotic expansions for the thermal stresses in bonded semiinfinite biomaterial strips. ASME Journal of Electronic Packaging ...

Author: E-H Wong

Publisher: Woodhead Publishing

ISBN: 0857099116

Category: Technology & Engineering

Page: 482

View: 200

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study

Practical Guide to the Packaging of Electronics

The interested reader is referred to Thermal Stress and Strain in Microelectronics Packaging (19). However, FEA must be employed for practical problems. In electronics packaging, the impact of thermal stress and strains is seen ...

Author: Ali Jamnia

Publisher: CRC Press

ISBN: 0824743415

Category: Technology & Engineering

Page: 224

View: 758

Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems. Practical Guide to the Packaging of Electronics discusses Packaging/enclosure design and reliability Thermal, junction-to-case, and contact interface resistance Direct and indirect flow system design Fin design and fan selection Vital elements of shock and vibration Thermal stresses and strains in the design and analysis of mechanically reliable systems Reliability models and system failure The selection of engineering software to facilitate system analysis Design parameters in an avionics electronics package Practical Guide to the Packaging of Electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines.

Practical Guide to the Packaging of Electronics Second Edition

One such circumstance where a closed-form solution may be obtained is the procedure for calculating thermal stresses and strains in plates (Jones 1975; Hall 1993). In this formulation, aside from the assumptions of linear elasticity, ...

Author: Ali Jamnia

Publisher: CRC Press

ISBN: 1420065408

Category: Technology & Engineering

Page: 320

View: 611

As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.